Semiconductor device
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorKazuhiro Inoue
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Abstract
Provided is a semiconductor device according to an embodiment including a first electrode terminal containing copper, a second electrode terminal containing copper, a semiconductor chip provide the first electrode terminal and provided inside the first electrode terminal, a metal member provided on the semiconductor chip, protruding to an outside of the semiconductor chip in at least two directions, electrically connected to the second electrode terminal, and containing copper, and a mold resin surrounding the semiconductor chip.
Claims11
A semiconductor device comprising:
- a first electrode terminal containing copper;
- a second electrode terminal containing copper;
- a semiconductor chip provided on the first electrode terminal, the semiconductor chip not protruding from an outer periphery of the first electrode terminal as viewed from above;
- a metal member provided on the semiconductor chip, the metal member protruding to an outside of the semiconductor chip in at least two directions parallel to a surface of the first electrode terminal, the metal member electrically connected to the second electrode terminal, and the metal member containing copper;
- a mold resin surrounding the semiconductor chip,
- a first bonding layer provided between the first electrode terminal and the semiconductor chip;
- a second bonding layer provided between the semiconductor chip and the metal member;
- and
- a third bonding layer provided between the second electrode terminal and the metal member, wherein the metal member has a groove provided on a surface of the metal member facing the semiconductor chip in a region protruding to the outside of the semiconductor chip, the groove has an inner edge and an outer edge, both the inner edge and the outer edge are located in the region protruding to the outside of the semiconductor chip.
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Dependencies are inferred from the claim text.