Semiconductor device, inverter unit and automobile
AssigneeMitsubishi Electric Corporation
InventorsYosuke NAKATA, Yuji IMOTO, Taishi SASAKI, Tatsuya KAWASE
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Abstract
A semiconductor chip (2a) is bonded to an upper surface of the conductive substrate (1a). A control terminal (11a) is disposed outside the semiconductor chip (2a) and connected to a control electrode of the semiconductor chip (2a) via a lead (12a). A case (10) surrounds the semiconductor chip (2a). A sealing material (13) seals the semiconductor chip (2a). The lead frame (4) includes a bonded part (4a) joined to the semiconductor chip (2a), and an upright part (4b) embedded in the case (10), extending from the bonded part (4a) to an outer side of the control terminal (11a), and standing upright vertically relative to an upper surface of the semiconductor chip (2a).
Claims16
A semiconductor device comprising:
- a conductive substrate;
- a semiconductor chip bonded to an upper surface of the conductive substrate;
- a control terminal disposed outside the semiconductor chip and connected to a control electrode of the semiconductor chip via a lead;
- a case surrounding the semiconductor chip;
- a lead frame;
- and
- a sealing material sealing the semiconductor chip,
- wherein the lead frame includes
- a bonded part joined to the semiconductor chip, and
- an upright part embedded in the case, extending from the bonded part to an outer side of the control terminal, and standing upright vertically relative to an upper surface of the semiconductor chip, and
- at least part of the upright part is formed inside of the control terminal.
Dependencies are inferred from the claim text.