Power Semiconductor Module

A power semiconductor module, comprising:

• a first semiconductor device;
• a second semiconductor device electrically connected in parallel to the first semiconductor device;
• and
• a control lead frame connected to a control electrode of the first semiconductor device via a first bonding wire and connected to a control electrode of the second semiconductor device via a second bonding wire,
• wherein the control lead frame includes a first lead frame portion, a bent portion, and a second lead frame portion connected to the first lead frame portion via the bent portion,
• one end of the first bonding wire is connected to the control electrode of the first semiconductor device, the other end of the first bonding wire is connected to the first lead frame portion or the bent portion,
• one end of the second bonding wire is connected to the control electrode of the second semiconductor device, the other end of the second bonding wire is connected to the second lead frame portion,
• the first lead frame portion extends in a direction overlapping with the first semiconductor device from the bent portion toward a side opposite to the first semiconductor device side, and
• the second lead frame portion extends in a direction overlapping with the second semiconductor device from the bent portion toward the second semiconductor device side.