Semiconductor device with sealed semiconductor chip

A semiconductor device comprising:

• a semiconductor chip with bonding pads, the bonding pads being arranged along one side of an element forming surface of the semiconductor chip;
• a lead frame including first internal leads and second internal leads, the first internal leads being arranged such that tips thereof correspond to some of the bonding pads of the semiconductor chip, and the second internal leads being arranged such that tips thereof pass a element non-forming surface of the semiconductor chip and correspond to some of other bonding pads of the semiconductor chip;
• first bonding wires by which the first internal leads and said some of the bonding pads are bonded to each other;
• second bonding wires by which the second internal leads and said some of other bonding pads are bonded to each other;
• a hanging pin section provided on the element non-forming surface of the semiconductor chip;
• and
• a sealing member with which the semiconductor chip is sealed including the hanging pin section and a bonding section between the first and second internal leads and the first and second bonding wires.