Cooling device, method for producing a cooling device and power circuit

A power circuit comprising:

• a heat sink comprising:
• an aluminum heat sink formed from a plurality of aluminum sheets stacked one above another and connected to one another, at least one aluminum sheet comprises cutouts which form a cooling channel covered by at least one of the aluminum sheets;
• at least one solder mediation layer connected to the aluminum heat sink by a solder layer;
• and
• a securing surface for securing and for heat absorption, the securing surface formed by a side of the solder mediation layer which faces away from the aluminum heat sink;
• a circuit board having a conductor layer on both sides, which is connected to the solder mediation layer via a solder layer;
• and
• at least one semiconductor mounted on the circuit board on the side of the circuit board which faces away from the solder mediation layer.