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US 2019/0295919 A1Published application
Semiconductor Device and Method for Manufacturing the Same
AssigneeMitsubishi Electric Corporation
InventorsYasuyuki Sanda, Dai Nakajima, Haruna Tada, Hodaka Rokubuichi, Kiyofumi Kitai
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Abstract
A semiconductor device includes a power module unit, a fin base, and a plurality of radiator fins. The power module unit and the fin base are integrated together, with a recess-projection portion formed on the power module unit being fitted to a recess-projection portion formed on the fin base. The plurality of radiator fins are integrally fitted on a heat radiation diffusion portion of the fin base.
Claims18
A semiconductor device comprising a power module unit, a fin base, and a radiator fin,
- the power module unit including
- a module base,
- a power semiconductor element mounted on the module base, and
- a mold resin sealing the power semiconductor element,
- the fin base including
- a heat radiation diffusion portion fitted with the radiator fin, and
- a base portion formed on the heat radiation diffusion portion, the module base being joined to the base portion,
- the heat radiation diffusion portion being larger in cross-sectional area than the module base.
5 more elements
A method for manufacturing a semiconductor device, comprising:
- forming a power module unit by mounting a power semiconductor element on a module base and by sealing the power semiconductor element with a mold resin so that a part of the module base is exposed, the part of the module base being on a side opposite to the power semiconductor element;
- preparing a fin base including
- a heat radiation diffusion portion having a caulking portion and a radiator fin insertion groove, and
- a base portion formed on a part of the heat radiation diffusion portion, the part of the heat radiation diffusion portion being on a side opposite to the caulking portion and the radiator fin insertion groove;
- placing the power module unit and the fin base so that the exposed part of the module base faces the base portion of the fin base, and placing each of a plurality of radiator fins in the corresponding radiator fin insertion groove;
- and
- joining the exposed part of the module base and the base portion of the fin base together and caulking the caulking portion to fit the plurality of radiator fins on the heat radiation diffusion portion by pressing the power module unit toward the fin base while a caulking jig is in contact with the caulking portion, thereby integrating the power module unit, the fin base, and the plurality of radiator fins together.
4 more elements
Dependencies are inferred from the claim text.