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US 2019/0295918 A1Published application
Monolithic microwave integrated circuit (mmic) cooling structure
AssigneeRaytheon Company
InventorsSusan C. Trulli, Anurag Gupta
Life of this patent
Estimating the term…
Abstract
A Monolithic Integrated Circuit (MMIC) cooling structure having a heat spreader thermally comprising a anisotropic material, such material having anisotropic heat conducting properties for conducing heat therethrough along a preferred plane, a surface of the MMIC being thermally coupled to the heat spreader, the preferred plane intersecting the surface of the MMIC; and, a thermally conductive base having a side portion thermally coupled to the heat spreader, the side portion being disposed in a plane intersecting the preferred plane.
Claims44
A cooling structure, comprising:
- a heat generating electric component;
- a heat spreader comprising thermally anisotropic material, such material having anisotropic heat conducting properties for conducing heat therethrough along preferred plane, a surface of the a heat generating electric component being thermally coupled to the heat spreader, the preferred plane intersecting the surface of the heat generating electric component;
- and,
- a thermally conductive base having a side portion thermally coupled to the heat spreader, the side portion being disposed in a plane intersecting the preferred plane.
1 more element
A cooling structure, comprising:
- a heat generating electric component;
- a heat spreader having anisotropic heat conducting properties for conducing heat therethrough along a preferred plane, a surface of the heat generating electric component being bonded to an upper surface of the heat spreader with a first layer of a thermal interface material, the conducting properties for conducing heat therethrough along the preferred plane intersecting the surface of the heat generating electric component;
- and
- a thermally conductive base having isotropic heat conducting properties, the thermally conductive base having a side portion thermally coupled to the heat spreader, the side portion being disposed in a plane intersecting the preferred plane.
1 more element
A cooling structure, comprising:
- a heat generating electric component;
- a heat spreader having anisotropic heat conducting properties for conducing heat therethrough along a preferred plane, a surface of the heat generating electric component being bonded to an upper surface of the heat spreader with a first layer of a thermal interface material, the conducting properties for conducting heat therethrough along the preferred plane intersecting the surface of the heat generating electric component;
- and
- a thermally conductive base having isotropic heat conducting properties, the thermally conductive base having a cavity in an upper surface, wherein a surface of the heat spreader different from the upper surface of the heat spreader is bonded to sidewall surfaces of the cavity of the thermally conductive base with a second layer of a thermal interface material.
1 more element
A cooling structure, comprising:
- a heat generating electric component;
- a heat spreader having anisotropic heat conducting properties for conducing heat therethrough along a preferred plane, a surface of the heat generating electric component being bonded to an upper surface of the heat spreader with a first layer of a thermal interface material, the conducting properties for conducing heat therethrough along the preferred plane intersecting the surface of the heat generating electric component;
- a thermally conductive base having isotropic heat conducting properties, the base having an opening in an upper surface, wherein a surface of the head spreader different from an upper surface of the heat spreader is bonded to sidewall surfaces of the opening of the thermally conductive base with a second layer of a thermal interface material.
A cooling structure comprising:
- a heat generating electric component having an upper surface and an opposing bottom surface, the heat generating electric component having an active, heat generating device formed in the upper surface;
- a heat spreader comprising an anisotropic material, such material having anisotropic heat conducting properties for conducting heat therethrough in a preferred plane, the bottom surface of the heat generating electric component being thermally coupled to the heat spreader preferred plane intersecting the surface of the heat generating electric component;
- and,
- a thermally conductive base having a side portion thermally coupled to the heat spreader the side portion being disposed in a plane intersecting preferred plane.
1 more element
A cooling structure, comprising:
- a heat generating electric component;
- a heat spreader having anisotropic heat conducting properties for conducing heat therethrough along a preferred plane, a surface of the heat generating electric component being bonded to an upper surface of the heat spreader, the heat conducting properties for conducing heat therethrough along the preferred plane intersecting the surface of the heat generating electric component;
- a thermally conductive base having isotropic heat conducting properties, the base having an opening in an upper surface, wherein a surface of the head spreader different from an upper surface of the heat spreader is bonded to sidewall surfaces of the opening of the thermally conductive base with a second layer of a thermal interface material.
A structure, comprising:
- a three-dimensional, thermally conductive support structure having a plurality of sides;
- and
- a pair of heat generation components bonded and thermally coupled to different sides of the three-dimensional, thermally conductive support structure.
Dependencies are inferred from the claim text.