Back to results
US 2019/0295910 A1Published application
Electronic device mounting board and electronic package
AssigneeKYOCERA Corporation
InventorKanae HORIUCHI
Life of this patent
Estimating the term…
Abstract
An electronic device mounting board includes an inorganic substrate, a frame, and a bond. The inorganic substrate includes, on an upper surface, a mount area on which an electronic device is mountable, and a surrounding area surrounding the mount area. The frame is located in the surrounding area of the inorganic substrate to surround the mount area. The bond is located in the surrounding area between the inorganic substrate and the frame. The bond has a plurality of cavities.
Claims8
An electronic device mounting board, comprising:
- an inorganic substrate including, on an upper surface, a mount area on which an electronic device is mountable, and a surrounding area surrounding the mount area;
- a frame located in the surrounding area of the inorganic substrate to surround the mount area;
- and
- a bond located in the surrounding area between the inorganic substrate and the frame, the bond having a plurality of cavities.
1 more element
Dependencies are inferred from the claim text.