Package substrate for semiconductor package, semiconductor package including the same and method of manufacturing the same

A package substrate for a semiconductor package, comprising:

• a substrate core including a through-hole penetrating the substrate core in a chip mounting region;
• and
• a plurality of wiring patterns on a top surface of the substrate core, each of the plurality of wiring patterns including a landing pad and an extension portion connected to the corresponding landing pad, wherein with respect to a top down view, at least some of the landing pads extend toward the through-hole in the chip mounting region, a spacing between adjacent ones of the landing pads is greater as a function of a distance away from the through-hole, and the landing pads are configured to be connected to an external device in the chip mounting region of the substrate core.