Targeted Recall of Semiconductor Devices Based on Manufacturing Data

A method for providing a targeted recall comprising:

• performing in-line measurements on a plurality of dies after one or more semiconductor fabrication steps to generate in-line measurement profiles for the plurality of dies;
• performing one or more measurements of the plurality of dies after one or more packaging steps to generate package characterization profiles for the plurality of dies;
• generating manufacturing fingerprints for the plurality of dies, the manufacturing fingerprints including the in-line measurement profiles, and the package characterization profiles of the plurality of dies, wherein the manufacturing fingerprints are referenced to unique electronic chip identifiers for the plurality of dies;
• determining at least a portion of the manufacturing fingerprint of a failed die of the plurality of dies;
• identifying one or more at-risk dies of the plurality of dies based on comparisons of manufacturing fingerprints of the plurality of dies with the at least a portion of the manufacturing fingerprint of the failed die;
• and
• recalling devices including the one or more at-risk dies.

A system for providing a targeted recall comprising:

• a controller communicatively coupled to a metrology sub-system and a failure analysis sub-system, the controller including one or more processors configured to execute program instructions causing the one or more processors to:
• generate manufacturing fingerprints for a plurality of dies, the manufacturing fingerprints including in-line measurement profiles of the plurality of dies received from the metrology sub-system based on in-line measurements after one or more semiconductor fabrication steps, the manufacturing fingerprints further including package characterization profiles of the plurality of dies received from the metrology sub-system based on measurements after one or more packaging steps, wherein the manufacturing fingerprints are referenced to unique electronic chip identifiers for the plurality of dies;
• identify one or more at-risk dies of the plurality of dies based on comparisons of manufacturing fingerprints of the plurality of dies with at least a portion of a manufacturing fingerprint of the failed die received from the failure analysis sub-system;
• and
• direct a targeted recall for the one or more at-risk dies.