Method for manufacturing element chip

A method for manufacturing an element chip, the method comprising:

• preparing a substrate including a first surface and a second surface on an opposite side of the first surface, the substrate including on the first surface
• a plurality of element regions each including an electrode, and
• a dividing region configured to define each of the plurality of element regions, the dividing region is lower in height than each of the element regions;
• sticking an adhesive tape having translucency to a side of the first surface of the substrate, and pressing the adhesive tape against the substrate to form
• a first close contact portion in which the substrate and the adhesive tape are in close contact with each other in each of the plurality of element regions, and
• a second close contact portion in which the substrate and the adhesive tape are in close contact with each other along the dividing region in the dividing region;
• measuring a position and a width of the second close contact portion in the dividing region;
• applying a laser beam having a beam diameter smaller than the width of the second close contact portion to the adhesive tape such that the laser beam does not protrude from the second close contact portion based on the width of the second close contact portion and the beam diameter, and forming an exposed portion configured to expose the dividing region of the substrate to the adhesive tape;
• exposing the first surface of the substrate to plasma with the second surface of the substrate held by a holding member, and while protecting each of the plurality of element regions from the plasma with the adhesive tape, etching the dividing region exposed in the exposed portion until the second surface is reached to dice the substrate into a plurality of element chips;
• and
• removing the adhesive tape remaining on the first surface of the substrate diced.