Wafer holding mechanism for rotary table and method and wafer rotating and holding device

A wafer holding method for a rotary table, the method comprising:

• using a wafer holding mechanism for the rotary table to hold a wafer, the wafer holding mechanism comprising:
• a rotary shaft, the rotary table being placed on an end of the rotary shaft and the rotary table being configured to hold a wafer on an upper surface of the rotary table;
• a drive motor configured to supply motive power to the rotary shaft;
• and
• a plurality of movable outer peripheral pins provided in the rotary table and the plurality of movable outer peripheral pins being configured to hold an outer periphery of the wafer, wherein the plurality of movable outer peripheral pins comprise a plurality of first movable outer peripheral pins and a plurality of second movable outer peripheral pins, the plurality of second movable outer peripheral pins being configured to hold the wafer at positions different from holding positions of the wafer by the plurality of first movable outer peripheral pins, wherein the plurality of second movable outer peripheral pins are configured to avoid holding the wafer during a period in which the plurality of first movable outer peripheral pins are holding the wafer, and the plurality of first movable outer peripheral pins are configured to avoid holding the wafer during a period in which the plurality of second movable outer peripheral pins are holding the wafer, wherein holding positions of the wafer are changed by switching holding by the first movable outer peripheral pins and holding by the second movable outer peripheral pins during processing of the wafer.

A wafer rotating and holding device, comprising:

• a wafer holding mechanism for a rotary table, the wafer holding mechanism comprising:
• a rotary shaft, the rotary table being placed on an end of the rotary shaft and the rotary table being configured to hold a wafer on an upper surface of the rotary table;
• a drive motor configured to supply motive power to the rotary shaft;
• and
• a plurality of movable outer peripheral pins provided in the rotary table and the plurality of movable outer peripheral pins being configured to hold an outer periphery of the wafer, wherein the plurality of movable outer peripheral pins comprise a plurality of first movable outer peripheral pins and a plurality of second movable outer peripheral pins, the plurality of second movable outer peripheral pins being configured to hold the wafer at positions different from holding positions of the wafer by the plurality of first movable outer peripheral pins, wherein the plurality of second movable outer peripheral pins are configured to avoid holding the wafer during a period in which the plurality of first movable outer peripheral pins are holding the wafer, and the plurality of first movable outer peripheral pins are configured to avoid holding the wafer during a period in which the plurality of second movable outer peripheral pins are holding the wafer, wherein holding positions of the wafer are changed by switching holding by the first movable outer peripheral pins and holding by the second movable outer peripheral pins during processing of the wafer.