Push-up device and push-up method for a semiconductor device

A push-up method for a semiconductor device using a lifting table having a plurality of lifting blocks, each of which includes a push-up surface for pushing up a semiconductor element bonded to a front surface of an adhesive sheet from a rear surface of the adhesive sheet, comprising:

• pushing up corner portions of the semiconductor element using a plurality of convex portions disposed on an outer periphery of the push-up surface of the lifting table to initially peel off the adhesive sheet from the semiconductor element at locations further outward from the corner portions;
• and
• sequentially raising at least two of the lifting blocks after the adhesive sheet is initially peeled off to further peel off the adhesive sheet from an outer side of the semiconductor element toward a center of the semiconductor element.

A push-up method for a semiconductor device using a lifting table having a plurality of lifting blocks, each of which includes a push-up surface for pushing up a semiconductor element bonded to a front surface of an adhesive sheet from a rear surface of the adhesive sheet, comprising:

• pushing up corner portions of the semiconductor element using a plurality of convex portions disposed on an outer periphery of the push-up surface of the lifting table to initially peel off the adhesive sheet from the semiconductor element at locations further outward from the corner portions;
• and
• sequentially lowering at least two of the lifting blocks after the adhesive sheet is initially peeled off to further peel off the adhesive sheet from an outer side of the semiconductor element toward a center of the semiconductor element.