Method of debonding work-carrier pair with thin devices

A method of manufacturing a semiconductor device, comprising:

• providing a first substrate bonded to a second substrate having an adhesive material forming an adhesive layer therebetween, wherein the first substrate includes at least one integrated circuit disposed on a surface thereof;
• applying a mechanical force to at least one of the first substrate and the second substrate in a direction substantially normal to the surface of the first substrate;
• and
• while applying the mechanical force to at least one of the first substrate and the second substrate, actuating an external device into direct physical contact with the adhesive layer in a direction parallel to the surface of the first substrate to facilitate separation of the first substrate from the second substrate.

A method of manufacturing a semiconductor device, comprising:

• providing a first substrate bonded to a second substrate by an adhesive material forming an adhesive layer therebetween, wherein the first substrate includes at least one integrated circuit disposed on a surface thereof;
• applying an electromagnetic force to at least one of the first substrate, the second substrate, and the adhesive layer;
• and
• while applying the electromagnetic force, actuating an external device into direct physical contact with the adhesive layer along a direction substantially parallel to the surface of the first substrate to facilitate separation of the first substrate from the second substrate.