Substrate processing tool with integrated metrology and method of using

A substrate processing method, comprising:

• processing a substrate in a first substrate processing chamber of a substrate processing tool;
• transferring the substrate from the first substrate processing chamber through a substrate transfer chamber to a substrate metrology module in the substrate processing tool;
• performing metrology on the substrate in the substrate metrology module;
• transferring the substrate from the substrate metrology module to a second substrate processing chamber through the substrate transfer chamber;
• and
• processing the substrate in the second substrate processing chamber.

A substrate processing method, comprising providing a substrate in a substrate processing tool, the substrate containing an exposed surface of a first material layer and an exposed surface of a second material layer;

• forming a self-assembled monolayer (SAM) on the substrate in a first substrate processing chamber;
• transferring the substrate from the first substrate processing chamber through a substrate transfer chamber to a second substrate processing chamber;
• and
• depositing a film on the first material layer and film nuclei on the self-assembled monolayer in the second substrate processing chamber;
• transferring the substrate from the second substrate processing chamber through the substrate transfer chamber to a substrate metrology module;
• performing metrology on the film in the substrate metrology module;
• transferring the substrate from the substrate metrology module through the substrate transfer chamber to a third substrate processing chamber;
• and
• removing the film nuclei from the self-assembled monolayer by etching in the third substrate processing chamber.