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US 2019/0295867 A1Published application
Substrate heating apparatus and substrate processing apparatus using the same
AssigneeTokyo Electron Limited
InventorSatoshi Oikawa
Life of this patent
Estimating the term…
Abstract
A substrate heating apparatus includes: a substrate support configured to substantially horizontally support a substrate; a heater provided below the substrate support substantially parallel to the substrate, and having a predetermined planar shape; and a side portion extending downward from an outer peripheral portion of the heater.
Claims15
A substrate heating apparatus comprising:
- a substrate support configured to substantially horizontally support a substrate;
- a heater provided below the substrate support substantially parallel to the substrate, and having a predetermined planar shape;
- and
- a side portion extending downward from an outer peripheral portion of the heater.
1 more element
Dependencies are inferred from the claim text.