Substrate treating method and substrate treating apparatus

Abstract

Disclosed is a substrate treating method comprising: a supply step of supplying a process liquid including a drying auxiliary substance in a melted state to a pattern formation surface of a substrate; a solidification step of solidifying the process liquid on the pattern formation surface so as to from a solidified body; and a removal step of removing the solidified body from the pattern formation surface, wherein a substance which satisfies at least one of the following conditions, namely a melting entropy under atmospheric pressure at a melting point of 1 mJ/cm3·K or more but 500 mJ/cm3·K or less and a sublimation entropy under atmospheric pressure at 0° C. of 1 mJ/cm3·K or more but 2000 mJ/cm3·K or less, is used as the drying auxiliary substance.

Dependencies are inferred from the claim text.