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US 2019/0295853 A1Published application
Apparatus for stressing semiconductor substrates
AssigneeGlobalWafers Co., Ltd.
InventorsRobert J. Falster, Vladimir V. Voronkov, John A. Pitney, Peter D. Albrecht
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Abstract
Apparatus for use in preparing heterostructures having a reduced concentration of defects including apparatus for stressing semiconductor substrates to allow them to conform to a crystal having a different crystal lattice constant.
Claims7
An apparatus for stressing a semiconductor substrate, the substrate having a front surface, a back surface and a peripheral edge, the apparatus comprising:
- a chamber,
- a heater for heating the chamber,
- a substrate holder mounted in the chamber, the holder including:
- a front ring,
- a back ring,
- a clamp for holding the front ring and back ring, and
- each ring including an annular support for contacting the substrate adjacent a peripheral edge of the substrate, the front ring adapted to contact the front surface and the back ring adapted to contact the back surface of the substrate.
4 more elements
Dependencies are inferred from the claim text.