Patterning method and patterned structure
AssigneesUnited Microelectronics Corp., Fujian Jinhua Integrated Circuit Co., Ltd.
InventorsFeng-Yi Chang, Fu-Che Lee
Life of this patent
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Abstract
A patterning method includes the following steps. A mask layer is formed on a material layer. A first hole is formed in the mask layer by a first photolithography process. A first mask pattern is formed in the first hole. A second hole is formed in the mask layer by a second photolithography process. A first spacer is formed on an inner wall of the second hole. A second mask pattern is formed in the second hole after the step of forming the first spacer. The first spacer surrounds the second mask pattern in the second hole. The mask layer and the first spacer are removed. The pattern of the first mask pattern and the second mask pattern are transferred to the material layer by an etching process.
Claims20
A patterned structure, comprising:
- a plurality of first sub patterns arranged in a first direction and a second direction, wherein the first sub patterns are arranged in the first direction by a first pitch;
- a plurality of second sub patterns arranged in the first direction and the second direction, wherein the second sub patterns are arranged in the first direction by a second pitch;
- and
- a plurality of third sub patterns arranged in the first direction and the second direction, wherein the third sub patterns are arranged in the first direction by a third pitch,
- wherein the first pitch, the second pitch, and the third pitch are equal to one another, and one of the second sub patterns and one of the third sub patterns are disposed between two of the first sub patterns adjacent to each other in the first direction, wherein a first smallest distance exists between one of the first sub patterns and one of the second sub patterns in the first direction, a second smallest distance exists between one of the second sub patterns and one of the third sub patterns in the first direction, and a third smallest distance exists between one of the first sub patterns and one of the third sub patterns in the first direction, wherein at least two selected from the group consisting of the first smallest distance, the second smallest distance, and the third smallest distance are different from one another.
A patterning method, comprising:
- forming a mask layer on a material layer;
- forming a first hole in the mask layer by a first photolithography process;
- forming a first mask pattern in the first hole;
- forming a second hole in the mask layer by a second photolithography process;
- forming a first spacer on an inner wall of the second hole;
- forming a second mask pattern in the second hole after the step of forming the first spacer, wherein the first spacer surrounds the second mask pattern in the second hole;
- removing the mask layer and the first spacer;
- and
- transferring the pattern of the first mask pattern and the second mask pattern to the material layer by an etching process.
Dependencies are inferred from the claim text.