Electrolytic plating apparatus
AssigneeToshiba Memory Corporation
InventorsFumito SHOJI, Tatsuo MIGITA, Masahiko MURANO
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Abstract
An electrolytic plating apparatus includes a plating tank that is filled with plating liquid; a moving mechanism configured to vertically move a processing target substrate in a direction normal to a surface of the plating liquid; a seal member that is disposed at a peripheral edge portion of a processing target surface of a processing target substrate and is configured to seal the plating liquid to a center side of the processing target surface when the processing target substrate is immersed in the plating tank; and a contact member that is separated from the seal member and is electrically connected to the processing target surface.
Claims20
An electrolytic plating apparatus comprising:
- a plating tank that is filled with plating liquid;
- a moving mechanism configured to vertically move a processing target substrate in direction normal to a surface of the plating liquid;
- a seal member that is disposed at a peripheral edge portion of a processing target surface of the processing target substrate and is configured to seal the plating liquid to a center side of the processing target surface when the processing target substrate is immersed in the plating tank;
- and
- a contact member that is separated from the seal member and is electrically connected to the processing target surface.
A method for electrolytic plating using an apparatus that includes a moving mechanism, a seal member, a contact member, and a plating tank, comprising:
- providing a processing target substrate such that the processing target substrate is in contact with the seal member, and at least one of the contact member and a support substrate;
- and
- immersing the processing target substrate in the plating tank using the moving mechanism such that the moving mechanism applies at least one of (i) a pressing force that is applied to the processing target substrate by the seal member, and (ii) a pressing force that is applied to the processing target substrate or the supporting substrate by the contact member.
Dependencies are inferred from the claim text.