Thin-film ceramic capacitor having capacitance forming portions separated by separation slit

A thin-film ceramic capacitor comprising:

• a body in which a plurality of first and second electrode layers are alternately stacked on a substrate, and in which a dielectric layer is disposed between adjacently stacked first and second electrode layers;
• and first and second electrode pads disposed on at least one external surface of the body,
• wherein a plurality of vias are disposed in the body,
• wherein a first via of the plurality of vias connects the first electrode layers and the first electrode pad to each other,
• the first via has a multi-step shape having a width that increases in a direction from the substrate towards an upper portion of the body,
• the width of the first via increases at each first electrode layer and remains constant through each second electrode layer,
• a first insulating layer extends along a wall of a portion of the first via having the constant width and is in direct contact with each second electrode layer,
• a separation slit is disposed to penetrate from an upper surface of the body and extend toward the substrate, and
• the second electrode pad is connected, as a single layer, to some vias of the plurality of vias disposed symmetrically in opposite sides of the separation slit.