Integrated circuit modules and smart cards incorporating the same

A smart card with both contact and contactless interfaces, the smart card comprising:

• a card body having a module cavity and an antenna coil;
• a pair of antenna-connecting elements;
• an integrated circuit (IC) module disposed in the cavity, the IC module comprising:
• a non-conductive substrate having a plurality of single-bond holes and a pair of multi-bond holes, both extending from a first to a second side of the substrate;
• a plurality of conductive contact pads, including a first pair thereof, arranged on the first side of the substrate;
• a first IC chip arranged on the second side of the substrate;
• a plurality of first conductive elements traversing the single-bond and the pair of multi-bond holes, and electrically connecting at least some of the contact pads to the first IC chip, wherein the first conductive elements include a first pair of first conductive elements respectively traversing the pair of multi-bond holes and electrically connecting the first pair of contact pads to the first IC chip;
• and
• an encapsulant deposited on the first IC chip, the first conductive elements and the first pair of contact pads, wherein an edge of the encapsulant deposited on the first pair of contact pads apportions each of the pair of multi-bond holes into an encapsulated first bonding channel and an adjoining unencapsulated second bonding channel respectively terminating at a first and an adjoining second bonding area on each of the first pair of contact pads such that the first pair of first conductive elements respectively traverse the first bonding channel of the pair of multi-bond holes and further such that the encapsulant seals the first bonding area, wherein at the second bonding channel, one of the pair of the antenna-connecting elements traverses the second bonding channel and connects between the antenna coil and the second bonding area such that electrical connection between the antenna coil and the first IC chip is established, wherein the encapsulant partitions the first and the second bonding area from each other without requiring a presence of the substrate therebetween.

A method of fabricating an integrated circuit (IC) module for smart card with both contact and contactless interfaces, the method comprising:

• having a non-conductive substrate having a plurality of single-bond holes and a pair of multi-bond holes, both extending from a first to a second side of the substrate, a plurality of conductive contact pads, including a first pair thereof, arranged on the first side of the substrate, a first IC chip arranged on the second side of the substrate, and a plurality of first conductive elements traversing the single-bond and the pair of multi-bond holes, and electrically connecting at least some of the contact pads to the first IC chip, wherein the first conductive elements include a first pair of first conductive elements respectively traversing the pair of multi-bond holes and electrically connecting the first pair of contact pads to the first IC chip;
• and
• depositing an encapsulant on the first IC chip, the first conductive elements and the first pair of contact pads, including
• apportioning, by an edge of the encapsulant, each of the pair of multi-bond holes into an encapsulated first bonding channel and an adjoining unencapsulated second bonding channel respectively terminating at a first and an adjoining second bonding area on each of the first pair of contact pads, wherein the first pair of first conductive elements respectively traverse the first bonding channel of the pair of multi-bond holes,
• without requiring the substrate between the first and the second bonding area, partitioning the first bonding area from the second bonding area by sealing the first bonding area with the encapsulant to define the first bonding channel and expose the second bonding area through the second bonding channel to provide a surface for establishing electrical connection to the first IC chip.

A single-side plated integrated circuit (IC) carrier tape adapted for use in smart card with both contact and contactless interfaces, the IC carrier tape comprising:

• a non-conductive substrate having a plurality of single-bond holes and a pair of multi-bond holes, both extending from a first to a second side of the substrate;
• a plurality of conductive contact pads, including a first pair thereof, arranged on the first side of the substrate;
• wherein the second side of the substrate is adapted to be arranged with a first IC chip thereon;
• wherein at least some of the contact pads are adapted to electrically connect to the first IC chip through a plurality of first conductive elements traversing the single-bond and the pair of multi-bond holes, wherein the first pair of contact pads are adapted to electrically connect to the first IC chip through a first pair of the first conductive elements traversing the pair of multi-bond holes;
• and
• wherein each multi-bond hole is adapted to be apportioned, by an edge of an encapsulant to be deposited on the first pair of contact pads, into an encapsulated first bonding channel and an adjoining unencapsulated second bonding channel respectively terminating at a first and an adjoining second bonding area on each of the first pair of contact pads such that the first pair of first conductive elements are adapted to respectively traverse the first bonding channel of the pair of multi-bond holes and further such that the encapsulant is adapted to seal the first bonding area and expose the second bonding area through the second bonding channel to provide a surface for establishing electrical connection to the first IC chip,
• wherein the first and the second bonding area are adapted to be partitioned from each other, by the encapsulant, without requiring a presence of the substrate therebetween.