Single chip multi-die architecture having safety-compliant cross-monitoring capability

A platform comprising:

• a set of sensors and actuators;
• and
• a chip coupled to the set of sensors and actuators, the chip including:
• a first die including a first processing logic to execute a first application instance based on communications with the set of sensors and actuators and generate a first output of the first application instance, and a second processing logic to execute a second application instance based on communications with the set of sensors and actuators and generate a second output of the second application instance, and
• a second die coupled to the first die, the second die including a safety monitor to detect a condition associated with one or more of an error in the first output, an error in the second output, or a discrepancy between the first output and the second output and initiate a transition of the chip into a safe state in response to the condition.

A method of operating a chip, comprising:

• generating, by a first die on the chip, a first output of a first application instance and a second output of a second application instance, wherein the first application instance is executing on a first processing logic of the first die and the second application instance is executing on a second processing logic of the first die;
• detecting, by a safety monitor on a second die on the chip, a condition associated with one or more of an error in the first output, an error in the second output, or a discrepancy between the first output and the second output;
• and
• initiating, by the safety monitor, a transition of the chip into a safe state in response to the condition.