Substrate processing control apparatus, recording medium, and method of manufacturing photomask
AssigneeToshiba Memory Corporation
InventorKentaro KASA
Life of this patent
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Abstract
In one embodiment, a substrate processing control apparatus includes a position information acquiring module configured to acquire information about a position of a first pattern that is formed in a substrate for a photomask to change an applied stress to the substrate or a transmittance of the substrate. The apparatus further includes a position determining module configured to determine, in accordance with the information about the position of the first pattern, a position of a second pattern to be formed in the substrate to change the applied stress to the substrate or the transmittance of the substrate.
Claims20
A substrate processing control apparatus comprising:
- a position information acquiring module configured to acquire information about a position of a first pattern that is formed in a substrate for a photomask to change an applied stress to the substrate or a transmittance of the substrate;
- and
- a position determining module configured to determine, in accordance with the information about the position of the first pattern, a position of a second pattern to be formed in the substrate to change the applied stress to the substrate or the transmittance of the substrate.
A computer readable recording medium that has non-temporarily recorded a substrate processing program of causing a computer to execute a substrate information processing method comprising:
- acquiring information about a position of a first pattern that is formed in a substrate for a photomask to change an applied stress on the substrate or a transmittance of the substrate;
- and
- determining, in accordance with the information about the position of the first pattern, a position of a second pattern to be formed to change the applied stress on the substrate or the transmittance of the substrate.
A method of manufacturing a photomask, comprising:
- acquiring information about a position of a first pattern that is formed in a substrate for a photomask to change an applied stress on the substrate or a transmittance of the substrate;
- determining, in accordance with the information about the position of the first pattern, a position of a second pattern to be formed in the substrate to change the applied stress on the substrate or the transmittance of the substrate;
- and
- processing the substrate in accordance with the information about the position of the second pattern to manufacture the photomask that includes the substrate.
Dependencies are inferred from the claim text.