Method And System For Implementing High-Speed Electrical Interfaces Between Semiconductor Dies In Optical Communication Systems

A method for processing signals, the method comprising:

• in a communication system, communicating electrical signals between a first die and a second die via coupling pads on said first die and said second die, wherein said coupling pads are located at low impedance points between two transistors in said communication system, wherein a first of said two transistors is integrated in said first die and a second of said two transistors is integrated in said second die.

A system for processing signals, the system comprising:

• a communication system comprising a first die and a second die, said first die and said second die comprising circuitry that is operable to communicate electrical signals between said first die and said second die via coupling pads on said first die and said second die, wherein said coupling pads are located at low impedance points between two transistors in said communication system, wherein a first of said two transistors is integrated in said first die and a second of said two transistors is integrated in said second die.

The system according to claim, 15, wherein said circuitry is operable to communicate said electrical signals via one or more capacitively-coupled interfaces.