Transistor outline package and method for producing a transistor outline package
AssigneeSchott AG
InventorsRobert Hettler, Georg Mittermeier
Life of this patent
Estimating the term…
Abstract
A transistor outline (TO) package including a header with at least one optoelectronic device. The header is bonded to a pot-shaped metal cap, which has a window that is transmissive to electromagnetic radiation, such that the at least one optoelectronic device is arranged in a hermetically sealed interior. The wall of the metal cap has at least one lateral wall portion and/or end wall portion which is thickened towards the interior compared to a portion of the lateral wall of the metal cap adjacent to the header.
Claims20
A transistor outline package, comprising:
- a header with at least one optoelectronic device;
- and
- a pot-shaped metal cap bonded to the header such that a hermetically sealed interior is formed, the at least one optoelectronic device is arranged in the interior, and the metal cap includes a window that is transmissive to electromagnetic radiation and a wall having a lateral wall and an end wall, wherein at least one of a portion of the lateral wall and a portion of the end wall is formed with an increased thickness towards the interior compared to a portion of the lateral wall adjacent to the header.
An assembly, comprising:
- a transistor outline (TO) package including a header with at least one optoelectronic device and a pot-shaped metal cap bonded to the header such that a hermetically sealed interior is formed, the at least one optoelectronic device is arranged in the interior, and the metal cap include a window that is transmissive to electromagnetic radiation and a wall having a lateral wall and an end wall, and at least one of a portion of the lateral wall and a portion of the end wall is formed with an increased thickness towards the interior compared to a portion of the lateral wall adjacent to the header;
- and
- an optical sub-assembly for connecting a light-conducting fiber, the optical sub-assembly including a housing that is welded to the metal cap at a location of at least one of the thickened portion of the lateral wall and the thickened portion of the end wall.
A method for producing a transistor outline package, comprising:
- providing a metal sheet;
- stamping a blank for a metal cap out of the metal sheet;
- embossing the blank to produce an opening, a first portion, and a second portion with a different wall thickness than the first portion;
- deep-drawing the blank into the metal cap;
- and, after deep-drawing,
- installing a lens in the opening.
Dependencies are inferred from the claim text.