Frontend integration of electronics and photonics
AssigneeUniversity Court of the University of St Andrews
InventorsKapil DEBNATH, William WHELAN-CURTIN
Life of this patent
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Abstract
A method of manufacturing a platform (10) for an integrated electronic and optical circuit comprises forming at least one optical device portion in a CMOS compatible substrate (12), wherein the optical device portion comprises a waveguide layer (22) and a barrier layer (20) arranged to confine light to a region of the waveguide layer, wherein forming the at least one optical device potion comprises: forming at least one trench (14) in the substrate (12); depositing the barrier layer (20) in the at least one trench (14); depositing the waveguide layer (22) over the barrier layer (20), and planarizing the substrate (12).
Claims15
A method of manufacturing a platform for an integrated electronic and optical circuit comprising:
- forming at least one optical device portion in a CMOS compatible substrate, wherein the optical device portion comprises a waveguide layer and a barrier layer arranged to confine light to a region of the waveguide layer, wherein forming the at least one optical device portion comprises:
- forming at least one trench in the substrate;
- depositing the barrier layer in the at least one trench;
- depositing the waveguide layer over the barrier layer, and
- planarizing the substrate.
An integrated electronic and optical circuit comprising:
- a CMOS compatible substrate, at least one electronic component on the CMOS compatible substrate and at least one optical device portion in a trench formed in the CMOS compatible substrate, wherein the at least one optical device portion comprises a waveguide layer and a barrier layer arranged to confine light to a region of the waveguide layer.
Dependencies are inferred from the claim text.