Stacked instrument architecture for testing and validation of electronic circuits
AssigneeIntel Corporation
InventorsErkan ACAR, Abram M. DETOFSKY, Jin PAN
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Abstract
In one embodiment, a device to test one or more electronic components comprises a first card comprising a first test device communicatively coupled to at least a first connector assembly positioned on the first card and a second card comprising a second test device communicatively coupled to at least a second connector assembly positioned on the second card. The at least a first connector assembly is directly communicatively coupled to the at least a second connector assembly to provide a direct communication interface between the first test device and the second test device that is not routed via a backplane. Other embodiments may be described.
Claims20
A device to test one or more electronic components, comprising:
- a first instrument card comprising a first test device communicatively coupled to at least a first connector assembly positioned on the first card;
- and
- a second instrument card comprising a second test device communicatively coupled to at least a second connector assembly positioned on the second card,
- wherein the at least a first connector assembly is directly communicatively coupled to the at least a second connector assembly to provide a direct communication interface between the first instrument card and the second instrument card that is not routed via a backplane.
A device to test one or more electronic components, comprising:
- a plurality of instrument cards comprising a plurality of test devices;
- and
- at least one device under test (DUT) card comprising a socket to receive the one or more electronic components to be tested,
- wherein the plurality of instrument cards and the at least one DUT card comprise connector assemblies to provide a direct communication interface between plurality of test cards and the one or more electronic components to be tested that is not routed via a backplane.
A method to test one or more electronic components, comprising:
- communicatively coupling a plurality of instrument cards comprising a plurality of test devices;
- and
- communicatively coupling the plurality of instrument cards to at least one device under test (DUT) card comprising a socket to receive the one or more electronic components to be tested,
- wherein the plurality of instrument and the at least one DUT card comprise connector assemblies to provide a direct communication interface between plurality of instrument cards and the one or more electronic components to be tested that is not routed via a backplane.
Dependencies are inferred from the claim text.