Guided inspection of a semiconductor wafer based on spatial density analysis
AssigneeApplied Materials Israel Ltd.
InventorsAriel HIRSZHORN, Yotam SOFER
Life of this patent
Estimating the term…
Abstract
Samples at a semiconductor wafer that have been reviewed by a review tool may be identified. Furthermore, a candidate sample at the semiconductor wafer that has not been reviewed by the review tool may be identified. A location of the candidate sample at the semiconductor wafer may and a number of the samples that have been reviewed that are at locations proximate to the location of the candidate sample may be determined. The candidate sample may be selected for review by the review tool based on the number of the plurality of samples that are at locations proximate to the location of the candidate sample.
Claims20
A system comprising:
- a memory;
- and
- a processing device, operatively coupled with the memory, to:
- identify a plurality of samples at a semiconductor wafer that have been reviewed by a review tool;
- identify a candidate sample at the semiconductor wafer that has not been reviewed by the review tool;
- determine a location of the candidate sample at the semiconductor wafer;
- determine a number of the plurality of samples that have been reviewed that are at locations proximate to the location of the candidate sample;
- and
- select the candidate sample for review by the review tool based on the number of the plurality of samples that are at locations proximate to the location of the candidate sample.
A method comprising:
- identifying a plurality of samples at a semiconductor wafer that have been reviewed by a review tool;
- identifying a candidate sample at the semiconductor wafer that has not been reviewed by the review tool;
- determining a location of the candidate sample at the semiconductor wafer;
- determining, by a processing device, a number of the plurality of samples that have been reviewed that are at locations proximate to the location of the candidate sample;
- and
- selecting the candidate sample for review by the review tool based on the number of the plurality of samples that are at locations proximate to the location of the candidate sample.
A non-transitory computer readable medium comprising instructions, which when executed by a processing device, cause the processing device to perform operations comprising:
- identifying a plurality of samples at a semiconductor wafer that have been reviewed by a review tool;
- identifying a candidate sample at the semiconductor wafer that has not been reviewed by the review tool;
- determining a location of the candidate sample at the semiconductor wafer;
- determining a number of the plurality of samples that have been reviewed that are at locations proximate to the location of the candidate sample;
- and
- selecting the candidate sample for review by the review tool based on the number of the plurality of samples that are at locations proximate to the location of the candidate sample.
Dependencies are inferred from the claim text.