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US 2019/0293322 A1Published application
Top mount cooling system and method for use thereof
AssigneeIce Qube, Inc.
InventorJamshaid Ullah
Life of this patent
Estimating the term…
Abstract
An embodiment provides a modular cooling device that is attachable to an enclosure such as a food or beverage cooler or refrigerator. In an embodiment, the modular cooling device includes various modules and is easy to assemble and disassemble. If one of the modules is damaged, it only requires the damaged module to be disassembled for repair or replacement, and the cooling function is restored, which solves inconvenient problems of conventional integrated refrigerators and like systems in terms of assembly, maintenance and repair. Other embodiments are described and claimed.
Claims20
A cooling device, comprising:
- a lower part including one or more enclosure side modules, the lower part including an upper surface, side surfaces, and a bottom surface, wherein the bottom surface is configured to form at least part of a top of an enclosure when mounted to the top of the enclosure by covering an opening defined within the top of the enclosure;
- the bottom surface including an enclosure air intake and an enclosure air return;
- an upper part including one or more ambient-side modules;
- and
- a shell that covers the lower part and separates the lower part from the upper part;
- the one or more ambient-side modules including a condenser module that includes one or more exhaust fans configured to draw ambient air into a side of the condenser module and exhaust ambient-side air upward from a top of the condenser module and away from the top of the enclosure;
- and
- the cooling device comprising an interface configured to reversibly attach to the top of the enclosure.
5 more elements
A kit, comprising:
- an attachment mechanism for securing a cooling device to a top of an enclosure that defines an opening for mounting the cooling device thereon;
- and
- a cooling device, comprising:
- a lower part including one or more enclosure side modules, the lower part including an upper surface, side surfaces, and a bottom surface, wherein the bottom surface is configured to form at least part of the top of the enclosure when mounted to the top of the enclosure by covering the opening defined within the top of the enclosure;
- the bottom surface including an enclosure air intake and an enclosure air return;
- an upper part including one or more ambient-side modules;
- and
- a shell that covers the lower part and separates the lower part from the upper part;
- the one or more ambient-side modules including a condenser module that includes one or more exhaust fans configured to draw ambient air into a side of the condenser module and exhaust ambient-side air upward from a top of the condenser module and away from the top of the enclosure.
6 more elements
A system, comprising:
- an enclosure;
- and
- a cooling device, comprising:
- a lower part including one or more enclosure side modules, the lower part including an upper surface, side surfaces, and a bottom surface, wherein the bottom surface is configured to form at least part of a top of the enclosure when mounted to the top of the enclosure by covering an opening defined within the top of the enclosure;
- the bottom surface including an enclosure air intake and an enclosure air return;
- an upper part including one or more ambient-side modules;
- and
- a shell that covers the lower part and separates the lower part from the upper part;
- the one or more ambient-side modules including a condenser module that includes one or more exhaust fans configured to draw ambient air into a side of the condenser module and exhaust ambient-side air upward from a top of the condenser module and away from the top of the enclosure;
- and
- the cooling device comprising an interface configured to reversibly attach to the top of the enclosure.
8 more elements
Dependencies are inferred from the claim text.