Gas distribution apparatus and substrate processing apparatus including the same

A substrate processing apparatus comprising:

• a substrate chuck configured to support a substrate;
• a shower head above the substrate chuck;
• a processing space between the shower head and the substrate chuck;
• and
• a gas distribution apparatus connected to the shower head and including a first dispersion space,
• wherein the shower head includes a second dispersion space in communication with the first dispersion space and having a volume greater than the first dispersion space, a plate under the second dispersion space, and a plurality of through holes penetrating the plate and fluidly connecting the second dispersion space and the processing space,
• wherein the gas distribution apparatus includes a dispersion container including the first dispersion space therein, a gas inlet section above the dispersion container, and a dispersion block connected to the dispersion container,
• wherein the gas inlet section includes a first inlet pipe including a first inlet path therein and a second inlet pipe including a second inlet path therein, and
• wherein at least a portion of a sidewall of the dispersion block is sloped with respect to a bottom wall of the dispersion container.

A semiconductor fabrication process comprising:

• mounting a semiconductor substrate on a substrate chuck;
• and
• providing a process gas to the semiconductor substrate through a gas distribution apparatus above the substrate chuck,
• wherein the gas distribution apparatus includes a dispersion container, a gas inlet section above the dispersion container, and a dispersion block connected to a bottom wall of the dispersion container and having a sidewall sloped with respect to the bottom wall of the dispersion container, and
• wherein the gas inlet section includes a first inlet pipe including a first inlet path through which a first inlet gas passes and a second inlet pipe including a second inlet path through which a second inlet gas passes.