Chemical mechanical polishing composition and method of manufacturing circuit board

A chemical mechanical polishing composition to be used for forming a circuit board including a resin substrate on which a wiring layer containing copper or a copper alloy is provided, the chemical mechanical polishing composition comprising:

• (A) at least one selected from a group consisting of organic acids and salts thereof;
• (B) a phosphorus-containing compound;
• and
• (C) abrasive grains each having an absolute value of a zeta potential in the chemical mechanical polishing composition of 5 mV or more,
• when a content of the component (A) in the chemical mechanical polishing composition is represented by MA mass % and a content of the component (B) in the chemical mechanical polishing composition is represented by MB mass %, a ratio MA/MB of the content of the component (A) to the content of the component (B) ranging from 1 to 10, and
• the chemical mechanical polishing composition having a pH value of from 1 to 3.