Polishing composition, method for producing polishing composition, and polishing method
AssigneeFujimi Incorporated
InventorsShota SUZUKI, Yoshihiro IZAWA
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Abstract
The present invention provides a polishing composition which polishes an object to be polished at a high polishing speed and with less scratches (defects). The present invention is a polishing composition including silica having a maximum peak temperature of 30° C. or higher and 53° C. or lower in a weight change rate distribution curve obtained by thermogravimetric measurement in a range of 25° C. or higher and 250° C. or lower, and having a pH at 25° C. of less than 6.0.
Claims10
A polishing composition comprising silica having a maximum peak temperature of 30° C. or higher and 53° C. or lower in a weight change rate distribution curve obtained by thermogravimetric measurement in a range of 25° C. or higher and 250° C. or lower, and having a pH at 25° C. of less than 6.0.
A method for producing a polishing composition used for polishing an object to be polished, comprising:
- providing silica having a maximum peak temperature of 30° C. or higher and 53° C. or lower in a weight change rate distribution curve obtained by thermogravimetric measurement in a range of 25° C. or higher and 250° C. or lower,
- mixing the silica with water, and
- adjusting a pH of mixture at 25° C. to less than 6.0.
Dependencies are inferred from the claim text.