Thermosetting resin composition for lds, resin molded article, and three-dimensional molded interconnect device
AssigneeSumitomo Bakelite Co., Ltd.
InventorToru MEURA
Life of this patent
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Abstract
The thermosetting resin composition for LDS of the invention includes a thermosetting resin, an inorganic filler, a non-conductive metal compound that forms a metal nucleus upon irradiation with active energy rays, and a coupling agent, in which the non-conductive metal compound includes one or more selected from the group consisting of a spinel-type metal oxide, a metal oxide having two or more transition metal elements in groups adjacent to each other, the groups being selected from groups 3 to 12 of the periodic table, and a tin-containing oxide, and the coupling agent includes one or more selected from the group consisting of mercaptosilane, aminosilane, and epoxysilane.
Claims17
A thermosetting resin composition for laser direct structuring (LDS), used for LDS, comprising
- a thermosetting resin;
- an inorganic filler;
- a non-conductive metal compound that forms a metal nucleus upon irradiation with active energy rays;
- and
- a coupling agent,
- wherein the non-conductive metal compound includes one or more selected from the group consisting of
- a spinel-type metal oxide,
- a metal oxide having two or more transition metal elements in groups adjacent to each other, the groups being selected from groups 3 to 12 of the periodic table, and
- a tin-containing oxide, and
- the coupling agent includes one or more selected from the group consisting of mercaptosilane, aminosilane, and epoxysilane.
Dependencies are inferred from the claim text.