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US 2019/0292364 A1Published application
Thermosetting resin composition, prepreg using same, laminated sheet, and printed circuit board
AssigneeDoosan Corporation
InventorsMoo Hyun KIM, Jeong Don KWON, Dong Hee JUNG, Ji Hong SHIN
Life of this patent
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Abstract
The present invention relates to a thermosetting resin composition, and a prepreg, a laminate sheet and a printed circuit board, which use the same. The thermosetting resin composition comprises: (a) a polyphenylene ether having two or more unsaturated substituents, selected from the group consisting of vinyl and allyl groups, at both ends of its molecular chain, or an oligomer thereof; and (b) a polytetrafluoroethylene (PTFE) filler.
Claims21
-10. (canceled)
A thermosetting resin composition comprising:
- (a) a polyphenylene ether having two or more unsaturated substituents, selected from the group consisting of vinyl and allyl groups, at both ends of its molecular chain, or an oligomer thereof;
- and
- (b) a polytetrafluoroethylene (PTFE) filler.
Dependencies are inferred from the claim text.