Copper plated carbon powders for copper-carbon composite fabrication
AssigneeGM Global Technology Operations LLC
InventorHongliang Wang
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Abstract
A copper-carbon composite forming mixture includes multiple carbon particles each plated with copper. The carbon particles prior to plating have an average size ranging between approximately 0.5 microns to 500 microns. Multiple copper particles are combined with the multiple carbon particles plated with copper to form a mixture. The mixture is either pre-heated prior to extrusion or extruded at ambient temperature to form a copper-carbon composite having a conductivity greater than a conductivity of copper at temperatures approximately 500 degrees Kelvin.
Claims20
A copper-carbon composite forming mixture, comprising:
- multiple carbon particles plated with copper;
- and
- multiple copper particles combined with the multiple carbon particles plated with copper to form a mixture.
A copper-carbon composite forming mixture, comprising:
- multiple carbon particles each plated with copper, the carbon particles prior to plating have an average size ranging between approximately 0.5 microns to 500 microns;
- and
- multiple copper particles combined with the multiple carbon particles plated with copper to form a mixture, the mixture when consolidated and extruded forming a copper-carbon composite having a conductivity greater than a conductivity of copper at temperatures above approximately 350 degrees Kelvin.
A method for creating a copper-carbon composite, comprising the steps of:
- plating multiple carbon particles with copper;
- creating a mixture containing the plated carbon particles and multiple copper particles;
- and
- processing a finished member by extruding the mixture, the finished member defining a copper-carbon composite having a conductivity greater than a conductivity of copper at temperatures above approximately 350 degrees Kelvin.
Dependencies are inferred from the claim text.