Integrated Micro-Electromechanical Device of Semiconductor Material Having a Diaphragm
AssigneeSTMicroelectronics S.r.l.
InventorsAlberto Pagani, Alessandro Motta
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Abstract
A method for making an integrated micro-electromechanical device includes forming a first body of semiconductor material having a first face and a second face opposite the first face. The first body includes a buried cavity forming a diaphragm delimited between the buried cavity and the first face. The diaphragm is monolithic with the first body. The method further includes forming at least one first magnetic via extending between the second face and the buried cavity of the first body, forming a first magnetic region extending over the first face of the first body, and forming a first coil extending over the second face of the first body and being magnetically coupled to the first magnetic via.
Claims20
A method for making an integrated micro-electromechanical device comprising:
- forming a first body of semiconductor material having a first face and a second face opposite the first face, the first body including a buried cavity forming a diaphragm delimited between the buried cavity and the first face, with the diaphragm being monolithic with the first body;
- forming at least one first magnetic via extending between the second face and the buried cavity of the first body;
- forming a first magnetic region extending over the first face of the first body;
- and
- forming a first coil extending over the second face of the first body and being magnetically coupled to the first magnetic via.
A method for making an integrated micro-electromechanical device, the method comprising:
- providing a first body comprising a semiconductor material having a first face and a second face opposite the first face,
- forming a diaphragm in the first body, the diaphragm being delimited between a buried cavity and the first face, wherein the diaphragm and interior surfaces of the buried cavity are each made of the semiconductor material;
- forming a first magnetic via extending between the second face and the buried cavity of the first body, the first magnetic via being separate from and below the buried cavity;
- forming a first magnetic region extending over the first face of the first body;
- forming a first coil extending over the second face of the first body and being magnetically coupled to the first magnetic via;
- and
- forming an insulating region including the first coil, the insulating region extending over the second face of the first body.
A method of operating an integrated micro-electromechanical device, the method comprising:
- supplying a first coil with an electrical current, the first coil being magnetically coupled to a first magnetic via within a first body of semiconductor material, wherein the first coil extends over a first face of the first body, and wherein the first magnetic via extends between the first face and a buried cavity of the first body, the first magnetic via being separate from the buried cavity;
- generating an attractive magnetic force between the first magnetic via and a first magnetic region using the electrical current in the first coil, wherein the first magnetic region extends over a second face of the first body, and wherein the second face is opposite the first face;
- and
- deflecting a diaphragm of the first body, the diaphragm being delimited between the buried cavity and the second face, wherein the diaphragm and interior surfaces of the buried cavity are each made of the semiconductor material.
Dependencies are inferred from the claim text.