Back to results
US 2019/0291430 A1Published application
Liquid ejecting head and method for manufacturing liquid ejecting head
AssigneeBrother Kogyo Kabushiki Kaisha
InventorsToru Kakiuchi, Yasuo Kato
Life of this patent
Estimating the term…
Abstract
A liquid ejection head manufacturing method comprising a step of forming a laminate, a step of connecting and a step of forming a protection film. The laminate includes electrodes and flow paths of liquid. The step of connecting is connecting terminals of a wiring substrate to terminals of the electrodes. The protection film is formed using atomic layer deposition, on a surface of the laminate defining the flow paths after connecting the terminals.
Claims32
A liquid ejection head manufacturing method comprising:
- forming a laminate including an electrode, the laminate defining a nozzle and a flow path configured to provide liquid communication to the nozzle;
- connecting a first terminal of a wiring substrate to the electrode;
- and
- forming a protection film on a surface of the laminate after connecting the terminal to the electrode.
1 more element
A liquid ejection head comprising;
- a laminate including an electrode, the laminate defining a nozzle and a flow path configured to provide liquid communication to the nozzle;
- a wiring substrate having a first terminal connected to the electrode;
- and
- a protection film on a surface of the laminate and a surface of the wiring substrate.
1 more element
A liquid ejection head manufacturing method comprising:
- forming a laminate including an electrode, the laminate defining a nozzle and a flow path configured to provide liquid communication to the nozzle;
- connecting a first terminal of a wiring substrate to the electrode;
- and
- forming a protection film on a surface of the laminate and the wiring substrate.
1 more element
Dependencies are inferred from the claim text.