Laser polishing ceramic surfaces of processing components to be used in the manufacturing of semiconductor devices
AssigneeApplied Materials, Inc.
InventorsGang Grant PENG, David W. GROECHEL, Tuochuan HUANG
Life of this patent
Estimating the term…
Abstract
Embodiments of the present disclosure provide methods of laser assisted modification, i.e., laser polishing, of ceramic substrates, or ceramic coated substrates, to desirably reduce the surface roughness and porosity thereof. In one embodiment, a method of laser polishing a workpiece surface includes scanning at least a portion of the workpiece surface with a pulsed laser beam. The laser beam has a pulse frequency of about 50 kHz or more and a spot size of about 10 mm2 or less and the workpiece surface comprises a ceramic material.
Claims20
A method of laser polishing a workpiece surface, comprising:
- scanning at least a portion of the workpiece surface with a pulsed laser beam having a pulse frequency of about 50 kHz or more and a spot size of about 10 mm2 or less, wherein the workpiece surface comprises a ceramic material.
A method of laser polishing a workpiece surface, comprising:
- scanning at least a portion of the workpiece surface with a pulsed laser beam having a pulse frequency of about 50 kHz or more and a spot size of about 10 mm2 or less, wherein
- the workpiece surface comprises a ceramic material, and
- the workpiece is a processing component for use with a plasma processing chamber, comprising one of a gas injector, a showerhead, a substrate support, a support shaft, a door, a liner, a shield, or a robot end effector.
A method of laser polishing a workpiece surface, comprising:
- scanning at least a portion of the workpiece surface with a pulsed laser beam having a pulse frequency of about 50 kHz or more and a spot size of about 10 mm2 or less, wherein
- the workpiece surface comprises a nitride, fluoride, oxide, oxynitride, or an oxyfluoride of aluminum, titanium, or yttrium, and
- the workpiece is a processing component for use with a plasma processing chamber, comprising one of a gas injector, a showerhead, a substrate support, a support shaft, a door, a liner, a shield, or a robot end effector.
Dependencies are inferred from the claim text.