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US 2019/0291206 A1Published application
Mitigation of particle contamination for wafer dicing processes
AssigneeApplied Materials, Inc.
InventorsWei-Sheng Lei, Jungrae Park, Ajay Kumar, Brad Eaton
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Abstract
Methods of dicing semiconductor wafers are described. In an example, a method of dicing a wafer having a plurality of integrated circuits thereon involves dicing the wafer into a plurality of singulated dies disposed above a dicing tape. The method also involves forming a material layer over and between the plurality of singulated dies above the dicing tape. The method also includes expanding the dicing tape, wherein a plurality of particles is collected on the material layer during the expanding.
Claims7
An apparatus, comprising:
- a plurality of singulated dies disposed above a dicing tape;
- a water soluble material layer disposed over and between the plurality of singulated dies above the dicing tape;
- and
- a plurality of particles on the water soluble material layer.
1 more element
An apparatus, comprising:
- a plurality of singulated dies disposed above an expanded dicing tape;
- a water soluble material layer disposed over and between the plurality of singulated dies above the expanded dicing tape;
- and
- a plurality of particles on the water soluble material layer.
1 more element
Dependencies are inferred from the claim text.