Ribbon wire bond
OwnerAmin Ahmad Sijelmassi, Bradley Glasscockinventors
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Abstract
In a described example, an electrical apparatus includes a substrate having a first surface and lead pads on the first surface of the substrate for surface mounting components. A ribbon wire bond is provided having open ends and a central portion between the open ends, the open ends of the ribbon wire bond connected to the lead pads. An electrical component is bonded to the central portion of the ribbon wire bond. The central portion of the ribbon wire bond and the electrical component are spaced from the first surface of the substrate.
Claims23
An electrical apparatus, comprising:
- a substrate having a first surface;
- lead pads on the first surface of the substrate;
- a ribbon wire bond having open ends connected to the lead pads and at least one central portion between the open ends;
- and
- an electrical component bonded to the at least one central portion of the ribbon wire bond, wherein the at least one central portion of the ribbon wire bond and the electrical component are spaced from the first surface of the substrate.
A method for making an electrical apparatus, comprising:
- making a ribbon wire bond with a shape that is one selected from a group consisting essentially of a U-shape and a W-shape, the ribbon wire bond having at least one central portion between open ends;
- soldering the open ends of the ribbon wire bond to lead pads on a first surface of a substrate;
- and
- mounting an electrical component to the at least one central portion of the ribbon wire bond, the electrical component and the at least one central portion spaced from the first surface of the substrate.
A method of making a ribbon wire bond comprising:
- opening a stamping die consisting of a first half and a second half configured to bend a wire into a ribbon wire bond;
- inserting a wire between the first half and second half of the open stamping die;
- closing the stamping die and bending the wire to form the ribbon wire bond and to detach the ribbon wire bond from the wire;
- and
- re-opening the stamping die and removing the ribbon wire bond.
Dependencies are inferred from the claim text.