Device, method of manufacturing the device, and method of manufacturing array type of ultrasound probe

A method of manufacturing a device having a plurality of function elements of predetermined thicknesses, comprising the steps of:

• adhering, on one surface of a support member, a first dry film resist through a release sheet, and exposing and developing the first dry film resist, thereby forming a plurality of first apertures in an array shape;
• adhering, on a surface of the first dry film resist, a second dry film resist having a thickness equivalent to those of the function elements, and exposing and developing the second dry film resist, thereby forming, right above each of the first apertures, respective second apertures larger than the first apertures;
• disposing the function elements on an inside of the second apertures so as to be supported by rim parts of the first apertures;
• adhering, in a state of being heated, a third dry film resist on a surface of the second dry film resist, and exposing and developing the third dry film resist, thereby forming third apertures respectively so that the function elements are sandwiched together with the first dry resist film;
• and
• forming a carrier member on a surface of the third dry film resist, and releasing along an interface between the first dry film resist and the release sheet.

A method of manufacturing an array type of ultrasound probe for measuring, by using a pulse-echo method, a diameter of blood vessel of a living body, comprising the steps of:

• preparing a plurality of piezoelectric elements having equivalent thicknesses, and forming a first electrode film over an entire one main surface of each piezoelectric elements;
• adhering, through a release sheet, a first dry film resist on one surface of a support, and exposing and developing the first dry film resist, thereby forming a plurality of first apertures in an array shape;
• forming a second electrode film on the surface of the first dry film resist by patterning;
• adhering, on the surface of the first dry film resist on which the second electrode film has been formed, a second dry film resist having thicknesses equivalent to those of the piezoelectric elements, and exposing and developing the second dry film resist, thereby forming second apertures larger than the first apertures right above each of the first apertures;
• disposing, on an inside of the second apertures, piezoelectric elements from the main surface side on which the first electrode film has been formed, so as to be supported by rim parts of the first apertures to thereby make an overall electrode in which the first electrode film and the second electrode film are connected to each other;
• adhering, in a state of being heated, a third dry film resist on a surface of the second dry film resist inclusive of another main surface of the piezoelectric elements, and exposing and developing the third dry film resist, thereby forming third apertures so as to sandwich the piezoelectric elements together with the first apertures;
• forming partial electrodes respectively on another main surface;
• and
• forming a backing material serving as a carrier member to cover the third dry film resist and the partial electrodes, and releasing along an interface between the first dry film resist and the release sheet.