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US 2019/0290243 A1Published application
Integrated ultrasonic transducers
AssigneeExo Imaging, Inc.
InventorsJanusz Bryzek, Sandeep Akkaraju, Yusuf Haque, Joe Adam
Life of this patent
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Abstract
A transducer assembly includes: a microelectromechanical systems (MEMS) die including a plurality of piezoelectric elements; a complementary metal-oxide-semiconductor (CMOS) die electrically coupled to the MEMS die by a first plurality of bumps and including at least one circuit for controlling the plurality of piezoelectric elements; and a package secured to the CMOS die by an adhesive layer and electrically connected to the CMOS die.
Claims29
A transducer assembly, comprising:
- a microelectromechanical systems (MEMS) die including a plurality of piezoelectric elements;
- a complementary metal-oxide-semiconductor (CMOS) die electrically coupled to the MEMS die by a first plurality of bumps and including at least one circuit for controlling the plurality of piezoelectric elements;
- and
- a package secured to the CMOS die by an adhesive layer and electrically connected to the CMOS die.
1 more element
An imaging device, comprising:
- a transducer assembly, including:
- a microelectromechanical systems (MEMS) die including a plurality of piezoelectric elements;
- a complementary metal-oxide-semiconductor (CMOS) die electrically coupled to the MEMS die by a first plurality of bumps and including at least one circuit for controlling the plurality of piezoelectric elements;
- and
- a package secured to the CMOS die by an adhesive layer and electrically connected to the CMOS die;
- a processor for processing signals from the transducer assembly;
- and
- a display for displaying an image based on signals processed by the processor.
5 more elements
Dependencies are inferred from the claim text.