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US 2019/0283070 A1Published application
Solvent-less method to manufacture thin film devices
AssigneeViavi Solutions Inc.
InventorsAlberto ARGOITIA, Kangning LIANG, Johannes P. SEYDEL, Jaroslaw ZIEBA
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Abstract
A method of forming a thin film device includes coating a web with a multi-layer thin film; and applying a mechanical force to release the multi-layer thin film from the web. Additional methods of forming a thin film device are disclosed.
Claims21
A method of forming a thin film device, comprising:
- coating a web with a multi-layer thin film;
- and
- applying a mechanical force to release the multi-layer thin film from the web.
A method of forming a thin film device, comprising:
- coating a web with a first layer;
- coating the first layer with a reflector layer;
- coating the reflector layer with a second layer to form a multi-layer thin film;
- and
- releasing the multi-layer thin film from the web by a dry technique.
2 more elements
A method of forming a thin film device, comprising:
- providing a web with a water-soluble release layer;
- coating the water-soluble release layer with a multi-layer thin film;
- and
- applying a mechanical force to release the multi-layer thin film from the web.
1 more element
Dependencies are inferred from the claim text.