Curable resin composition and adhesive for bonding structural material using composition
AssigneeAdeka Corporation
InventorsMitsunori IDE, Keisuke OTA, Tamotsu NAGAMATSU
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Abstract
To show a curable resin composition suitable as an adhesive for bonding a structural material having good adhesiveness to aluminum in particular. A curable resin composition containing (A1) phosphoric acid-modified epoxy resin obtained by reacting a phosphoric acid (a1) and an epoxy compound (a2) (excluding a urethane-modified epoxy resin and a urethane-modified chelate epoxy resin); and (A2) an epoxy resin (excluding component (A1)); (B) a block urethane; and (C) a latent curing agent, in which a phosphorus content in a total mass of component (A1) and component (A2) is 0.01 to 2.0% by mass.
Claims6
A curable resin composition comprising:
- (A1) a phosphoric acid-modified epoxy resin obtained by reacting a phosphoric acid (a1) and an epoxy compound (a2) excluding a urethane-modified epoxy resin and a urethane-modified chelate epoxy resin;
- and
- (A2) an epoxy resin excluding component (A1);
- (B) a block urethane;
- and
- (C) a latent curing agent,
- wherein a phosphorus content in a total mass of component (A1) and component (A2) is 0.01 to 2.0% by mass.
Dependencies are inferred from the claim text.