# US 2019/0246503 A1 · Electronic Circuit Production

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- Number: US 2019/0246503 A1
- Document ID: US20190246503A1
- Status: Published application
- Kind: A1
- Application number: 16/384,327
- Filed: 2019-04-15
- Published: 2019-08-08
- Earliest claimed: 2013-09-19
- Assignees: DST Innovations Limited
- Applicants: DST Innovations Limited
- Inventors: Anthony Miles; Robert Miles
- Web page: https://patentgrep.com/patent/US20190246503A1

## CPC

- H05K 3/07: being removed electrolytically
- C25D 5/34: Pretreatment of metallic surfaces to be electroplated
- C25D 7/00: Electroplating characterised by the article coated
- C25D 7/0628: {In vertical cells}
- C25D 17/00: Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25F 3/02: Etching
- C25F 7/00: Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects (for both electrolytic coating and removal C25D); Servicing or operating
- H05K 3/068: {Apparatus for etching printed circuits}
- H10P 50/613: {of Group IV materials}
- C25D 7/0657: {Conducting rolls}
- C25D 7/0678: {using masks}
- C25D 9/08: by cathodic processes
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- C25D: PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25F: PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

Electrolytic Etching/Deposition System. A system for continuous circuit fabrication comprising means for storing and dispensing the substrate, means for laminating the substrate, means for printing the substrate, means for optical inspection of the substrate, means for photolithography of the substrate, means for drying the substrate, means for developing the substrate, means for washing the substrate and means for electroplating the substrate.

## Claims

### Claim at position 1

1-9. (canceled)

### Claim 10

A method of electrolytic etching, comprising:
a. introducing a continuous section of substrate into an electrolyte within a container;
b. applying a voltage between a first electrode in electrical contact with the electrolyte and a second electrode physically separated from the first electrode and in electrical contact with the substrate and thereby etching the substrate by electrolysis; and
c. at a subsequent time, reversing the polarities of the first electrode in electrical contact with the electrolyte and the second electrode in electrical contact with the substrate and thereby increasing the thickness of the etched layer of the substrate by electrolytic deposition.

### Claim 11 (depends on 10)

The method of claim 10, wherein the second electrode is in electrical contact with the substrate via means for introducing the continuous section of substrate through the electrolyte.

### Claim at position 4

12-13. (canceled)

### Claim 14 (depends on 11)

The method of claim 11, wherein the means for introducing the continuous section of substrate through the electrolyte comprises a feed roller.

### Claim 15 (depends on 10)

The method of claim 10, wherein the first electrode is removable from the container.

### Claim 16 (depends on 15)

The method of claim 15, further comprising removing the first electrode from the container.

### Claim 17 (depends on 10)

The method of claim 10, wherein the container includes a drain for draining the electrolyte.

### Claim 18 (depends on 17)

The method of claim 17, further comprising draining at least some of the electrolyte using the drain.

### Claim 19 (depends on 10)

The method of claim 10, wherein the container includes a guide for guiding the continuous section of the substrate.

### Claim 20 (depends on 19)

The method of claim 19, further comprising guiding the continuous section of the substrate through the container using the guide.

### Claim 21 (depends on 10)

The method of claim 10, further comprising one or more of: means for storing and dispensing the substrate, means for laminating the substrate, means for printing the substrate, means for optical inspection of the substrate, means for photolithography of the substrate, means for drying the substrate, means for developing the substrate, and means for washing the substrate.

### Claim 22 (depends on 10)

The method of claim 10, wherein at least some of the material that is removed from the substrate during the step of etching is re-deposited onto the etched layer of the substrate during the step of increasing the thickness of the etched layer of the substrate by electrolytic deposition.

### Claim 23 (depends on 22)

The method of claim 22, wherein the at least some of the material that is removed from the substrate during the step of etching was deposited onto the first electrode, and is re-deposited onto the etched layer from the first electrode.