# US 2019/0246500 A1 · Electronic package including cavity defined by resin and method of forming same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0246500 A1 - Document ID: US20190246500A1 - Status: Published application - Kind: A1 - Application number: 16/389,598 - Filed: 2019-04-19 - Published: 2019-08-08 - Earliest claimed: 2016-04-01 - Assignees: Skyworks Filter Solutions Japan Co., Ltd. - Applicants: Skyworks Filter Solutions Japan Co., Ltd. - Inventors: Atsushi Takano; Mitsuhiro Furukawa; Ichiro Kameyama; Tetsuya Uebayashi - Web page: https://patentgrep.com/patent/US20190246500A1 ## CPC - H05K 1/181: associated with surface mounted components - H03H 9/0523: {for flip-chip mounting} - H03H 9/059: {consisting of mounting pads or bumps} - H03H 9/1042: {the enclosure being defined by a housing formed by a cavity in a resin} - H03H 9/1085: {the enclosure being defined by a non-uniform sealing mass covering the non-active sides of the SAW device} - H03H 9/17: having a single resonator (crystal tuning forks H03H9/21) - H03H 9/25: Constructional features of resonators using surface acoustic waves {(devices for manipulating acoustic surface waves in general G10K11/36)} - H05K 1/111: {Pads for surface mounting, e.g. lay-out} - H05K 3/303: with surface mounted components (H05K3/32 takes precedence) - H10W 74/121: {by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation} - H05K 2201/10068: Non-printed resonator - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A method of manufacturing an electronic device includes preparing an electronic component including a first substrate on a main surface of which a functional unit and a first resin layer are formed. The first resin layer has a first surface facing the main surface of the first substrate, a second surface opposed to the first surface, a cavity on the first surface enclosing the functional unit, and a portion defining a wall of the cavity. The first resin layer defines a recess provided with a solder layer on the second surface. The method further includes preparing a second substrate having an electrode pad formed on a main surface, aligning the electronic component with the second substrate to layer the solder layer and the electrode pad in contact with the solder layer, and forming the electronic component and the second substrate into the electronic device. ## Claims ### Claim 1 A method of manufacturing an electronic device, the method comprising: preparing an electronic component including a first substrate on a main surface of which a functional unit and a first resin layer are formed, the first resin layer having a first surface facing the main surface of the first substrate and a second surface opposed to the first surface, the first resin layer including a cavity on the first surface enclosing the functional unit, a portion of the first surface defining a wall of the cavity parallel to the main surface of the substrate, the first resin layer defining a recess on the second surface, the recess being provided with a solder layer; preparing a second substrate having an electrode pad formed on a main surface of the second substrate; aligning the electronic component with the second substrate to layer the solder layer and the electrode pad in contact with the solder layer to have a combined thickness corresponding to a depth of the recess; and forming the electronic component and the second substrate into the electronic device. ### Claim 2 (depends on 1) The method of claim 1 wherein forming the electronic component and the second substrate into the electronic device includes sealing the electronic component and the second substrate with a second resin layer. ### Claim 3 (depends on 2) The method of claim 2 wherein sealing the electronic component and the second substrate with the second resin layer is performed by transfer molding. ### Claim 4 (depends on 2) The method of claim 2 wherein sealing the electronic component and the second substrate with the second resin layer is performed by compression molding. ### Claim 5 (depends on 2) The method of claim 2 wherein forming the electronic component and the second substrate into the electronic device includes welding the solder layer onto the electrode pad. ### Claim 6 (depends on 5) The method of claim 5 welding the solder layer onto the electrode pad includes melting the solder layer to be bonded to the electrode pad. ### Claim 7 (depends on 6) The method of claim 6 wherein welding the solder layer onto the electrode pad further includes cooling the solder layer. ### Claim 8 (depends on 7) The method of claim 7 wherein forming the electronic component and the second substrate into the electronic device includes bonding the electronic component to the second substrate with the first resin layer by pressure bonding with a compression force caused by volume contraction of the solder layer upon the cooling of the solder layer. ### Claim 9 (depends on 2) The method of claim 2 wherein a gap between the second surface of the first resin layer and the main surface of the second substrate is minimized to be less than a size of a filler dispersed in a material of the second resin layer. ### Claim 10 (depends on 1) The method of claim 1 wherein preparing the electronic component includes forming the solder layer within the recess, the solder layer not exceeding the second surface in a thickness direction. ### Claim 11 (depends on 1) The method of claim 1 wherein preparing the electronic component includes forming one of a surface acoustic wave element or a film bulk acoustic resonator having a mechanically moveable portion as the functional unit on the main surface of the first substrate. ### Claim 12 (depends on 1) The method of claim 1 further comprising selecting a substrate formed of a dielectric material as the first substrate. ### Claim 13 (depends on 12) The method of claim 12 further comprising selecting a substrate formed of a piezoelectric material as the first substrate. ### Claim 14 (depends on 1) The method of claim 1 further comprising forming a through hole in the resin layer extending from the recess and passing through the resin layer to the main surface of the first substrate. ### Claim 15 (depends on 14) The method of claim 14 further comprising electrically connecting the solder layer to the main surface with a metal layer distinct from the solder layer formed within the through hole, the metal layer, solder layer, and electrode pad having a combined thickness corresponding to a distance between the main surface of the first substrate and the main surface of the second substrate. ### Claim 16 (depends on 1) The method of claim 1 wherein preparing the electronic component includes forming the resin layer with the first surface in contact with the with the main surface of the first substrate. ### Claim 17 (depends on 1) The method of claim 1 wherein preparing the electronic component includes forming the resin layer with the second surface in contact with the with the main surface of the second substrate. ### Claim 18 A method of manufacturing an electronic component, comprising: forming a functional unit on a main surface of a substrate; forming a resin layer on the main surface, the resin layer having a first surface facing the main surface and a second surface opposed to the first surface; forming a cavity enclosing the functional unit by the first surface, a portion of the first surface defining a wall of the cavity parallel to the main surface of the substrate; forming a recess on the second surface; and forming a solder layer in the recess that does not to exceed the second surface in a thickness direction. ### Claim 19 (depends on 18) The method of claim 18 wherein the cavity is defined by the resin layer. ### Claim 20 (depends on 18) The method of claim 18 wherein forming the resin layer includes forming a dam portion extending from the second surface of the resin layer.