# US 2019/0246100 A1 · In-Layer Signal Processing > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0246100 A1 - Document ID: US20190246100A1 - Status: Published application - Kind: A1 - Application number: 15/890,976 - Filed: 2018-02-07 - Published: 2019-08-08 - Earliest claimed: 2018-02-07 - Assignees: Lockheed Martin Corporation - Applicants: Lockheed Martin Corporation - Inventors: Mark A. Lamkin; Kyle Martin Ringgenberg; Jordan David Lamkin - Web page: https://patentgrep.com/patent/US20190246100A1 ## CPC - H04N 13/388: Volumetric displays, i.e. systems where the image is built up from picture elements distributed through a volume - G06T 7/557: from light fields, e.g. from plenoptic cameras - H10W 90/00: Package configurations - H04N 2213/001: Constructional or mechanical details - H05K 1/0277: {Bendability or stretchability details (H05K1/038, H05K3/4691 take precedence)} - H05K 1/189: characterised by the use of flexible or folded printed circuits - H05K 2201/10128: Display - H05K 2201/10151: Sensor - H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION - G06T: IMAGE DATA PROCESSING OR GENERATION, IN GENERAL - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract In one embodiment, an electronic display assembly includes a sensor array located on one side of a circuit board, an electronic display array located on an opposite side of the circuit board from the sensor array, and a logic unit layer coupled to one side of the circuit board. The logic unit layer is configured to receive first signals from the sensor array, perform at least one operation on the received first signals to create second signals, and transmit the second signals to the electronic display array. The first signals are communicated using a particular signal protocol and correspond to light captured by sensor pixels of the sensor array. The second signals are communicated using the particular signal protocol of the first signals and are operable to instruct the electronic display array to display light corresponding to the light captured by the plurality of sensor pixels. ## Claims ### Claim 1 An electronic display assembly comprising: a circuit board; a sensor array located on one side of the circuit board, the sensor array comprising at least a first and a second sensor pixel unit, each of the first and second sensor pixel units comprising a plurality of sensor pixels; an electronic display array located on an opposite side of the circuit board from the sensor array, the electronic display array comprising at least a first and a second display pixel unit, each of the first and second display pixel units comprising a plurality of display pixels; and a logic unit layer coupled to one side of the circuit board, the logic unit layer comprising at least a first and a second logic unit, wherein: the first logic unit is operable to: receive first sensor signals from the first sensor pixel unit, the first sensor signals communicated using a particular signal protocol, the first sensor signals corresponding to light captured by the plurality of sensor pixels of the first sensor pixel unit; perform at least one operation on the received first sensor signals to create first display signals; and transmit the first display signals to the first display pixel unit, the first display signals communicated using the particular signal protocol, the first display signals operable to instruct the first display pixel unit to display light corresponding to the light captured by the plurality of sensor pixels of the first sensor pixel unit; and the second logic unit is operable to: receive second sensor signals from the second sensor pixel unit, the second sensor signals communicated using the particular signal protocol, the second sensor signals corresponding to light captured by the plurality of sensor pixels of the second sensor pixel unit; perform at least one operation on the received second sensor signals to create second display signals; and transmit the second display signals to the second display pixel unit, the second display signals communicated using the particular signal protocol, the second display signals operable to instruct the second display pixel unit to display light corresponding to the light captured by the plurality of sensor pixels of the second sensor pixel unit. ### Claim 2 (depends on 1) The electronic display assembly of claim 1, wherein the logic unit layer is between the sensor array and the circuit board. ### Claim 3 (depends on 2) The electronic display assembly of claim 2, wherein the logic unit layer and the sensor array are combined into a single three-dimensional integrated circuit using through-silicon vias. ### Claim 4 (depends on 1) The electronic display assembly of claim 1, wherein the logic unit layer is between the electronic display array and the circuit board. ### Claim 5 (depends on 4) The electronic display assembly of claim 4, wherein the logic unit layer and the electronic display array are combined into a single three-dimensional integrated circuit using through-silicon vias. ### Claim 6 (depends on 1) The electronic display assembly of claim 1, wherein: the particular signal protocol comprises a chip-to-chip interconnect protocol; and performing the at least one operation on the received first and second sensor signals comprises transforming the received first and second sensor signals to include augmented information for display on the first and second display pixel units. ### Claim 7 (depends on 6) The electronic display assembly of claim 6, wherein the chip-to-chip interconnect protocol comprises low-voltage differential signaling (LVDS) or Inter-Integrated Circuit (I2C). ### Claim 8 An electronic display assembly comprising: a sensor array located on one side of a circuit board, the sensor array comprising one or more sensor pixel units, each sensor pixel unit comprising a plurality of sensor pixels; an electronic display array located on an opposite side of the circuit board from the sensor array, the electronic display array comprising one or more display pixel units, each display pixel unit comprising a plurality of display pixels; and a logic unit layer coupled to one side of the circuit board, the logic unit layer comprising a plurality of logic units, the logic unit layer configured to: receive first signals from the sensor array, the first signals communicated using a particular signal protocol, the first signals corresponding to light captured by the plurality of sensor pixels; perform at least one operation on the received first signals to create second signals; and transmit the second signals to the electronic display array, the second signals communicated using the particular signal protocol of the first signals, the second signals operable to instruct the electronic display array to display light corresponding to the light captured by the plurality of sensor pixels. ### Claim 9 (depends on 8) The electronic display assembly of claim 8, wherein the logic unit layer is between the sensor array and the circuit board. ### Claim 10 (depends on 9) The electronic display assembly of claim 9, wherein the logic unit layer and the sensor array are combined into a single three-dimensional integrated circuit using through-silicon vias. ### Claim 11 (depends on 8) The electronic display assembly of claim 8, wherein the logic unit layer is between the electronic display array and the circuit board. ### Claim 12 (depends on 11) The electronic display assembly of claim 11, wherein the logic unit layer and the electronic display array are combined into a single three-dimensional integrated circuit using through-silicon vias. ### Claim 13 (depends on 8) The electronic display assembly of claim 8, wherein: the particular signal protocol comprises a chip-to-chip interconnect protocol; and performing the at least one operation on the received first signals to create second signals comprises transforming the received first signals to include augmented information for display on the electronic display array. ### Claim 14 (depends on 13) The electronic display assembly of claim 13, wherein the chip-to-chip interconnect protocol comprises low-voltage differential signaling (LVDS) or Inter-Integrated Circuit (I2C). ### Claim 15 A method of manufacturing an electronic display, the method comprising: coupling a plurality of sensor units to a first side of a circuit board, each sensor unit being coupled to one of a plurality of unit attachment locations, each sensor unit comprising a plurality of sensor pixels; forming a plurality of display units, each display unit formed by combining an electronic display and a logic unit into a single three-dimensional integrated circuit using through-silicon vias, each display unit comprising a plurality of display pixels; and coupling the plurality of display units to a second side of the circuit board that is opposite the first side, each logic unit being coupled to a respective one of the unit attachment locations. ### Claim 16 (depends on 15) The method of manufacturing the electronic display of claim 15, wherein the circuit board is flexible. ### Claim 17 (depends on 15) The method of manufacturing the electronic display of claim 15, wherein each particular unit attachment location comprises a ball grid array configured to couple to one of the plurality of sensor units and one of the plurality of display units. ### Claim 18 (depends on 17) The method of manufacturing the electronic display of claim 17, wherein each particular unit attachment location further comprises a plurality of interconnection pads configured to electrically couple the particular unit attachment location to one or more adjacent unit attachment locations. ### Claim 19 (depends on 15) The method of manufacturing the electronic display of claim 15, wherein the plurality of unit attachment locations are arranged into a plurality of columns. ### Claim 20 (depends on 19) The method of manufacturing the electronic display of claim 19, wherein the plurality of unit attachment locations are further arranged into a plurality of rows.