# US 2019/0245124 A1 · Quantum dot led and manufacturing method for the same

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- Number: US 2019/0245124 A1
- Document ID: US20190245124A1
- Status: Published application
- Kind: A1
- Application number: 16/007,852
- Filed: 2018-06-13
- Published: 2019-08-08
- Earliest claimed: 2018-02-06
- Assignees: Huizhou China Star Optoelectronics Technology Co., Ltd.
- Applicants: Huizhou China Star Optoelectronics Technology Co., Ltd.
- Inventors: Yong FAN
- Web page: https://patentgrep.com/patent/US20190245124A1

## CPC

- H10H 20/8512: {Wavelength conversion materials}
- H10H 20/8506: {Containers}
- H10H 20/8515: {not being in contact with the bodies}
- H10H 20/854: characterised by their material, e.g. epoxy or silicone resins
- H10H 20/0361: {of wavelength conversion means}
- H10H 20/0362: {of encapsulations}
- H10H 20/8511: {characterised by their material, e.g. binder}
- H10H 20/8513: {having two or more wavelength conversion materials}
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS

## Abstract

A quantum dot LED and a manufacturing method for the same are disclosed. The quantum dot LED includes a pair of electrodes disposed separately and side by side; an LED chip disposed on the pair of electrodes and electrically connected to the pair of electrodes; a quantum dot layer disposed on the LED chip; a glue layer disposed on the quantum dot layer; and an inorganic encapsulation layer that packages and covers the pair of electrodes, the LED chip, the quantum dot layer and the glue layer. The present invention can provide a water and oxygen isolation environment, which is beneficial to increase the luminous efficiency and life of the quantum dots. Adopting an atomic layer deposition method to form the inorganic encapsulation layer, the surface is smooth and even in thickness, the problem of cracking of the film layer will not generate.

## Claims

### Claim 1

A quantum dot LED, comprising:
a pair of electrodes disposed separately and side by side;
an LED chip disposed on the pair of electrodes and electrically connected to the pair of electrodes;
a quantum dot layer disposed on the LED chip;
a glue layer disposed on the quantum dot layer; and
an inorganic encapsulation layer that packages and covers the pair of electrodes, the LED chip, the quantum dot layer and the glue layer;
wherein the glue layer is disposed on a top surface of the quantum dot layer and interposed between the top surface of the quantum dot layer and the inorganic encapsulation layer, so as to form a layer that is in direct contact with the quantum dot layer for isolating the quantum dot layer from external moisture and oxygen and protecting the quantum dot layer against invasion of the external moisture and oxygen.

### Claim 2 (depends on 1)

The quantum dot LED according to claim 1, wherein the inorganic encapsulation layer is manufactured by an atomic layer deposition method, and a thickness of the inorganic encapsulation layer is in a range of 10 nm to 120 nm.

### Claim 3 (depends on 2)

The quantum dot LED according to claim 2, wherein the inorganic encapsulation layer is a single-layered structure, a material of the inorganic encapsulation layer is anyone of Al2O3, ZrO2, and TiO2.

### Claim 4 (depends on 2)

The quantum dot LED according to claim 2, wherein the inorganic encapsulation layer is a multi-layered structure, wherein a material of each layer of the multi-layered structure is anyone of Al2O3, ZrO2, and TiO2.

### Claim 5 (depends on 4)

The quantum dot LED according to claim 4, wherein materials of adjacent layers of the multi-layered structure of the inorganic encapsulation layer are different.

### Claim 6 (depends on 1)

The quantum dot LED according to claim 1, wherein the quantum dot LED further includes an organic protection layer that packages and covers the inorganic encapsulation layer.

### Claim 7 (depends on 6)

The quantum dot LED according to claim 6, wherein a refractive index of the organic protection layer is less than a refractive index of the inorganic encapsulation layer.

### Claim 8 (depends on 1)

The quantum dot LED according to claim 1, wherein the LED chip is a blue LED chip.

### Claim 9

A manufacturing method for quantum dot LED, comprising steps of:
disposing a pair of electrodes separately and side by side;
disposing an LED chip on the pair of the electrodes and electrically connecting the LED chip to the pair of the electrodes;
disposing a quantum dot layer on the LED chip;
disposing a glue layer on the quantum dot layer; and
using an atomic layer deposition method to form an inorganic encapsulation layer, and the inorganic encapsulation layer packages and covers the pair of electrodes, the LED chip, the quantum dot layer and the glue layer;
wherein the glue layer is disposed on a top surface of the quantum dot layer and interposed between the top surface of the quantum dot layer and the inorganic encapsulation layer, so as to form a layer that is in direct contact with the quantum dot layer for isolating the quantum dot layer from external moisture and oxygen and protecting the quantum dot layer against invasion of the external moisture and oxygen.

### Claim 10 (depends on 9)

The manufacturing method for quantum dot LED according to claim 9, wherein the manufacturing method further includes a step of disposing an organic protection layer, and the organic protection layer packages and covers the inorganic encapsulation layer.