# US 2019/0244997 A1 · Methods and Apparatus for Sensor Module

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- Number: US 2019/0244997 A1
- Document ID: US20190244997A1
- Status: Published application
- Kind: A1
- Application number: 16/384,480
- Filed: 2019-04-15
- Published: 2019-08-08
- Earliest claimed: 2012-09-07
- Assignees: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicants: Taiwan Semiconductor Manufacturing Company, Ltd.
- Inventors: Kuo-Chung Yee; Chun Hui Yu
- Web page: https://patentgrep.com/patent/US20190244997A1

## CPC

- H10F 39/026: {Wafer-level processing}
- H10F 39/011: {Manufacture or treatment of image sensors covered by group H10F39/12}
- H10F 39/199: {Back-illuminated image sensors}
- H10F 39/804: {Containers or encapsulations}
- H10F 39/8053: {Colour filters}
- H10F 39/811: {Interconnections}
- H10F 39/813: {Electronic components shared by multiple pixels, e.g. one amplifier shared by two pixels}
- H10W 20/20: Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Methods and apparatus for integrating a CMOS image sensor and an image signal processor (ISP) together using an interposer to form a system in package device module are disclosed. The device module may comprise an interposer with a substrate. An interposer contact is formed within the substrate. A sensor device may be bonded to a surface of the interposer, wherein a sensor contact is bonded to a first end of the interposer contact. An ISP may be connected to the interposer, by bonding an ISP contact in the ISP to a second end of the interposer contact. An underfill layer may fill a gap between the interposer and the ISP. A printed circuit board (PCB) may further be connected to the interposer by way of a solder ball connected to another interposer contact. A thermal interface material may be in contact with the ISP and the PCB.

## Claims

### Claim 1

A device, comprising:
a back-side illuminated (BSI) device;
an interposer over the BSI device, the interposer having a plurality of conductive vias formed therein, the interposer having a contact pad;
a passivation layer over the interposer, the passivation layer at least partially covering a surface of the contact pad distal the BSI device;
a printed circuit board (PCB) electrically coupled to the contact pad of the interposer through a conductive bump; and
an image signal processor (ISP) device disposed in a through cavity of the PCB and bonded to the interposer with an underfill disposed therebetween, the ISP device being electrically coupled to the plurality of conductive vias, wherein a surface of the passivation layer and a surface of the underfill are level with one another and contact the interposer.

### Claim 2 (depends on 1)

The device of claim 1, further comprising a heat spreader attached to the ISP device.

### Claim 3 (depends on 2)

The device of claim 2, wherein the heat spreader is attached to the printed circuit board and the ISP device through a thermal interface material extending from the heat spreader to the printed circuit board and the ISP device.

### Claim 4 (depends on 2)

The device of claim 2, wherein the heat spreader has a width greater than a width of the through cavity.

### Claim 5 (depends on 1)

The device of claim 1, wherein the underfill is separated from the passivation layer.

### Claim 6 (depends on 1)

The device of claim 1, wherein the underfill has a width equal to a width of the ISP device.

### Claim 7 (depends on 1)

The device of claim 1, wherein the conductive bump is electrically coupled to the contact pad through an under bump metal (UBM) pad, wherein a contact of the ISP device is electrically coupled to one of the conductive vias through a solder region, the solder region extending continuously from the contact of the ISP device to the one of the conductive vias.

### Claim 8

A device, comprising:
an image sensor device;
an interposer having a first surface and a second surface opposite the first surface, the first surface of the interposer being bonded to a first surface of the image sensor device, wherein the interposer comprises one or more conductive vias extending through the interposer;
a passivation layer over the one or more conductive vias;
an image signal processor (ISP) bonded to the second surface of the interposer, a first via of the one or more conductive vias electrically coupling the image sensor device to the ISP;
an underfill disposed between the ISP and the second surface of the interposer, a first surface of the underfill and a first surface of the passivation layer contacting the second surface of the interposer, the first surface of the underfill and the first surface of the passivation layer being level with one another; and
a heat spreader bonded to the ISP opposite the interposer.

### Claim 9 (depends on 8)

The device of claim 8, wherein the heat spreader is bonded to the ISP through a thermal interface material.

### Claim 10 (depends on 8)

The device of claim 8, wherein the ISP is disposed within a cavity in a printed circuit board.

### Claim 11 (depends on 10)

The device of claim 10, further comprising a redistribution layer (RDL) on the second surface of the interposer, wherein the printed circuit board is bonded to the second surface of the interposer through a solder ball bonded to the RDL.

### Claim 12 (depends on 11)

The device of claim 11, wherein the RDL is between the passivation layer and the one or more conductive vias, the passivation layer covering sidewalls of the RDL and covering a first portion of a first surface of the RDL while exposing a second portion of the first surface of the RDL, the second portion of the first surface being bonded to the solder ball.

### Claim 13 (depends on 8)

The device of claim 8, wherein the interposer is bonded to the image sensor device through direct copper bonding and direct oxide bonding.

### Claim 14 (depends on 8)

The device of claim 8, wherein the underfill is separated from the passivation layer by a gap.

### Claim 15

A device, comprising:
a sensor device over a color filter layer;
an interposer over and bonded to the sensor device, wherein a plurality of conductive vias extend through the interposer;
an image signal processor (ISP) over and bonded to the interposer, wherein the ISP and the sensor device are electrically coupled through the plurality of conductive vias; and
a printed circuit board over and bonded to the interposer, wherein the ISP is disposed within a cavity of the printed circuit board.

### Claim 16 (depends on 15)

The device of claim 15, further comprising:
an RDL disposed over the interposer; and
solder balls bonded to the RDL, wherein the printed circuit board is bonded to the interposer through the solder balls.

### Claim 17 (depends on 15)

The device of claim 15, wherein a surface of the ISP distal the interposer is level with a surface of the printed circuit board distal the interposer.

### Claim 18 (depends on 15)

The device of claim 15, further comprising a passivation layer on the interposer and an underfill layer disposed between the interposer and the ISP, the underfill layer and the passivation layer being in contact with the interposer, wherein a surface of the passivation layer in contact with the interposer is level with a surface of the underfill layer in contact with the interposer, and wherein the passivation layer is physically separated from the underfill layer.

### Claim 19 (depends on 15)

The device of claim 15, wherein a heat sink is bonded to the ISP and the printed circuit board through a thermal interface material.

### Claim 20 (depends on 15)

The device of claim 15, wherein the sensor device and the interposer are bonded together by direct copper bonds and direct oxide bonds.